Binghamton University will lead the New York node of a new $75 million, five-year federal initiative to advance flexible hybrid electronics manufacturing following the US Department of Defense (DoD) choice of the Flex Tech Alliance, of which Binghamton University is a founding partner, as America’s first Innovation Institute for Flexible Hybrid Electronics Manufacturing (FHE MII).
“The Flex Tech Alliance and Binghamton University have been leaders in the advancement of flexible electronics manufacturing for nearly a decade,” Binghamton University President Harvey Stenger said. “This latest news is an extraordinary affirmation of the work being done by the Alliance and of the work being done by our own researchers here on campus.”
Flexible hybrid electronics use both traditional chips as well as printed electronics on plastic, thin glass, paper and fabric that can bend with applications including bandages that can sense when the wound they’re covering is infected, as well as wearable patches that monitor human performance, said Mark Poliks of the Center for Advanced Microelectronics Manufacturing (CAMM).
The other FHE applications include: health monitoring patches, medical devices, sensors, imaging systems, prosthetic devices, energy storage and energy harvesting devices.
As part of the New York node, Binghamton University will work with New York state companies including Corning, Inc., i3 Electronics, General Electric and Lockheed-Martin to develop and manufacture this new technology. More companies are expected to join the initiative. Cornell University and the SUNY Network of Excellence in Materials and Advanced Manufacturing, representing all four SUNY research campuses, are also expected to participate.